Results 1 to 3 of 3

Your favorite Apple, iPhone, iPad, iOS, Jailbreak, and Cydia site.


Thread: Intel and Micron Reveal New 3D NAND Flash Memory, Could Lead to Larger Storage Options

  1. #1
    What's Jailbreak? Akshay Masand's Avatar
    Join Date
    Sep 2011
    Location
    New York City
    Posts
    5,897
    Thanks
    3
    Thanked 200 Times in 179 Posts

    Default Intel and Micron Reveal New 3D NAND Flash Memory, Could Lead to Larger Storage Options


    Intel and Micron recently announced the launch of a new 3D NAND flash technology, one that could possibly help improve the amount of data storage possible in Apple devices such as Macs, iPhones, iPads and several other devices. Unlike conventional planar NAND flash memory, 3D NAND is stacked in 32 vertical layers.

    According to Intel the technology can potentially triple capacity for various sized hard drives. For example, a conventional 2.5-inch solid state drive (SSD) may be able to surpass 10 terabytes. The technology is also said to have a variety of other benefits including high speeds, a lower cost per gigabyte and better endurance. It should also save power by enabling new sleep modes that cut power to inactive NAND die while other die continue to remain in use. A 256-gigabit multilevel cell (MLC) version of the memory is now being sampled with “select partners” according to Intel. A denser 384-gigabit triple level cell (TLC) product will be sampled later this season. Both iterations of the memory should be in full-scale production by the fourth quarter of 2015 and matching Intel and Micron SSD lines should be on sale “within the next year.”

    For Apple, the technology could potentially allow the company to completely forego conventional hard disks in Macs and eliminate storage anxiety with iOS devices. Although iPhones and iPads have recently doubled in capacity of their middle and upper tiers with the current generation lineup, the introductory tier remains stuck at 16 GB, which is an increasingly tight limit on the content users can carry.

    On the other hand, Toshiba seems to have revealed its own 3D flash memory. Toshiba’s iteration is a 48-layer MLC format that uses a vertical stacking system called BiCS (Bit Cost Scaling). This can hold 128 gigabits per chip and sample shipments begin soon. It’s likely for mass production to be made available in the first half of next year.

    Source: Intel

    Twitter: @AkshayMasand

  2. #2
    iPhone? More like MyPhone Carlos's Avatar
    Join Date
    Aug 2007
    Location
    Pittsburgh
    Posts
    104
    Thanks
    1
    Thanked 10 Times in 10 Posts

    Nice!! Technology Technology Technology

  3. #3
    Quote Originally Posted by Carlos View Post
    Nice!! Technology Technology Technology

Posting Permissions
  • You may not post new threads
  • You may not post replies
  • You may not post attachments
  • You may not edit your posts
  •