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  • Suppliers prepare for iPhone 7's Dual Camera & Possible Stereo Speakers


    Today, Apple's chip suppliers Cirrus Logic and Analog Devices (ADI) have started a production line on the rumored iPhone 7, according to DigiTimes. The production is expected to ramp up in the second and third quarters, ahead of the smartphone's rumored launch in September.

    Both, Cirrus Logic and Analog Devices (ADI) are among the major IC manufactures for Apple, they will reportedly play a key role in the iPhone 7 which is rumored to be slimmer than the existing models of iPhone that exist today. ADI will offer driver components for a dual-lens design for the model, the sources noted.

    Cirrus Logic is notable given that Barclays analysts believe the iPhone 7 will have dual speakers supplied by the Austin-based company. In a research note to investors, Barclays said the second speaker will likely take over the space currently occupied by the 3.5mm headphone jack on current iPhones.

    Multiple sources have reported that Apple will remove the 3.5mm headphone jack on the iPhone 7 in favor of an all-in-one Lightning connector for audio output, charging, and connecting peripherals. The device would also expectedly support Bluetooth headphones, and a digital-to-audio adapter could allow use of wired headphones.

    Meanwhile, at least one iPhone 7 or 7 Plus model is expected to have a dual-lens camera system, with driver components supplied by ADI, the report claims. The dual-lens hardware could be based on LinX technology, which could lead to brighter and clearer DSLR-quality photos and several other major advantages.

    The report also corroborates rumors claiming Apple will move away from Samsung and source most or all of its A10 chips for the iPhone 7 from its longtime Taiwanese supplier TSMC. The foundry has reportedly been aggressively expanding its 16nm FinFET production capacity and expects to begin volume production of chips based on its integrated fan-out (InFO) technology in the second quarter.

    In late September, hardware teardowns showed the iPhone 6s and iPhone 6s Plus use different-sized A9 chips from Samsung and TSMC. Samsung's 14-nanometer chip measures in at 96 square millimeters, while TSMC's 16-nanometer chip has a size of 104.5 square millimeters.

    The difference between the chips is small in size, but early benchmarks found TSMC's A9 chip outperformed Samsung's in battery life by up to 22 percent. Apple later stated there is only 2-3 percent variance in "real world" battery life between the chips, which shortly after was proven by controlled battery life tests.

    In addition, TSMC is expected to grab most of or probably all orders for Apple's A10 processors which will be featured in the iPhone 7 series, the sources indicated. The foundry has been aggressively expanding its 16nm FinFET process production capacity, and is set to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016.

    Original Source
    This article was originally published in forum thread: Suppliers prepare for iPhone 7's Dual Camera & Possible Stereo Speakers started by Caiden Spencer View original post