Taiwanese Apple rumor site, Apple.pro, recently published scans of an article that originally ran in the paper edition of the Chinese-language Apple Daily, in which the publication took measurements of one of many leaked enclosures that are believed to represent a genuine pre-production parts for the next-generation iPhone. The enclosure measures 58.47mm wide, 123.83mm long, and 7.6mm thick. The measurements point towards the next-generation iPhone being approximately 18% thinner than the 9.3mm thick iPhone 4S. The reduction is attributed towards the following series of modifications:
- an elongation of the design by 8.63mm (~7.5%) to accommodate a 4-inch screen;
- relocation of the headphone jack to the base of the unit;
- inclusion of a new nano-SIM tray comprising 40% less space than the current Micro-SIM tray in the iPhone 4S;
- a more compact MagSafe-style Dock connector with 8 or 9 pins as opposed to the 30-pin Dock connector shipping on current devices; and
- a general reduction in the size of several internal components due to broader industry advancements.
It should be noted that the dimensions for the new iPhone reported by Apple Daily’s aren’t entirely new, instead they serve as further support of measurements that originally surfaced in June from a set of leaked Apple schematics. Speculation points towards the next-generation iPhone not only being thinner but also have a display with roughly 30% more real estate as part of its overall redesign.
Apple is expected to introduce its new iPhone on September 12th during a media event in California so we’ll have to keep our eyes out for any announcements.
Source: Apple.Pro via Google Translate. MobileFun
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