The DigiTimes has published a list (image above) of what it says are the suppliers of components for the next generation iPhone due in June. Included on that list is a 3.2 megapixel camera which is a nice improvement over the current model's 2 megapixel camera.
TSMC have landed foundry orders for GSM EDGE power amplifiers, Bluetooth ICs and 3.2-megapixel OmniVision CMOS image sensor (CIS) used in the upcoming iPhone model, indicated the sources. Xintec will handle the packaging and testing service for the CIS whereas VisEra will manufacture on-chip color filters for the CIS.
The so-called "iPhone 3.0" reportedly will be launched by mid-2009, the sources claimed. Assembly suppliers will kick off shipments for the upcoming model starting from May, with the first batch estimated to be around five million units, the sources said.